一種線路板的新型隔熱結(jié)構(gòu)——2020神燈獎申報技術(shù)

項目名稱：  一種線路板的新型隔熱結(jié)構(gòu)

Novel Heat Insulation Structure Of Circuit Board

申報單位：  深圳市領(lǐng)德輝科技有限公司

綜合介紹或申報理由：

本實用新型的線路板的新型隔熱結(jié)構(gòu)，通過連接柱與通孔以及焊盤配合實現(xiàn)防護(hù)板與主板體的固定，隔熱板和防護(hù)板都具有隔熱作用，防護(hù)板上的支撐柱陣列具有支撐作用，還具有易于通風(fēng)的作用，因此這種隔熱結(jié)構(gòu)具有隔熱效果好的優(yōu)點，防護(hù)板還能有效防止主板體變形，因此，這種線路板的新型隔熱結(jié)構(gòu)具有良好的防護(hù)性能。

The novel heat insulation structure of the circuit board of the utility model realizes the fixation of the protection board and the main board body through the cooperation of the connection post with the through hole and the pad. It has a supporting effect and also has the function of easy ventilation. Therefore, this thermal insulation structure has the advantage of good thermal insulation effect. The protective plate can also effectively prevent the deformation of the main board body. Therefore, the new thermal insulation structure of this circuit board has good protection .

主要技術(shù)參數(shù)：

本實用新型涉及一種線路板的新型隔熱結(jié)構(gòu)，產(chǎn)品特點：

a、絕緣層薄，熱阻小

b、無磁性

c、散熱好

d、機(jī)械強(qiáng)度高

產(chǎn)品標(biāo)準(zhǔn)厚度：0.8、1.0、1.2、1.5、2.0、2.5、3.0mm

銅箔厚度：1.8um 35um 70um 105um 140um

The utility model relates to a novel thermal insulation structure of a circuit board.

 Features:

a.Thin insulation layer and low thermal resistance

b.Non-magnetic

c.Good heat dissipation

d.High mechanical strength

Product standard thickness：0.8、1.0、1.2、1.5、2.0、2.5、3.0mm

Copper foil thickness:18um 35um 70um 105um 140um

技術(shù)及工藝創(chuàng)新要點：

一種線路板的新型隔熱結(jié)構(gòu)，包括主板體和背板的支撐板，主板體和背板的支撐板之間設(shè)有隔離層，支撐板上設(shè)有多根垂直于支撐板板面的連接柱，隔離板和主板體上均設(shè)有多個與所述連接柱位置相對應(yīng)的通孔，通孔的外端部設(shè)有焊盤，多個連接柱對應(yīng)從多個通孔中穿出并顯露出外端部，連接柱的外端部與焊盤焊連。主板體.隔離板.支撐板均為方形板體。

A novel heat-insulating structure for a circuit board includes a main board body and a support plate for the back plate. An isolation layer is provided between the main board body and the support plate for the back plate. The support plate is provided with a plurality of connecting posts perpendicular to the surface of the support plate. A plurality of through holes corresponding to the positions of the connecting pillars are provided on the isolation board and the main board body. Pads are provided at the outer ends of the through holes, and the multiple connecting pillars are correspondingly penetrated  the multiple through holes and exposed. Out of the outer end, the outer end of the connection post is soldered to the pad. The main board body, the isolation plate and the support plate are all square plate bodies.

獲獎、專利情況：

申報單位介紹：

領(lǐng)德輝立足于線路板、鋁基板及FPC的制造，兼具優(yōu)質(zhì)、低價和快速的鋁基板和FPC制作配合等優(yōu)勢，旨在為業(yè)界提供高性能、低成本的PCB線路板及配套解決方案。公司已全套引進(jìn)國際標(biāo)準(zhǔn)的全自動生產(chǎn)設(shè)備，配備整套先進(jìn)的檢測設(shè)備，并全面貫徹執(zhí)行ISO質(zhì)量管理體系。

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