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              CMH全無機(jī)封裝技術(shù)——2019神燈獎(jiǎng)申報(bào)技術(shù)

              2019/3/31 16:54:02 作者: 來源:廣州市鴻利秉一光電科技有限公司
              摘要:CMH全無機(jī)封裝技術(shù),為廣州市鴻利秉一光電科技有限公司2019神燈獎(jiǎng)申報(bào)技術(shù)。


              項(xiàng)目名稱:  CMH全無機(jī)封裝技術(shù)

              CMH Inorganic package technology

              申報(bào)單位:  廣州市鴻利秉一光電科技有限公司

              綜合介紹或申報(bào)理由:

              CMH全無機(jī)封裝技術(shù)是廣州市鴻利秉一光電科技有限公司開發(fā)且有專利保護(hù)的一種新型封裝技術(shù),即采用陶瓷(Ceramic)、金屬(Metal)和硬質(zhì)玻璃(Hard Glass)等無機(jī)材料,通過特種焊接技術(shù)將芯片(UV LED/VCSEL等)封裝于由全無機(jī)材料組成的密閉腔體內(nèi)。CMH全無機(jī)封裝技術(shù)是國(guó)內(nèi)首創(chuàng)的封裝技術(shù),具有可靠性高、效率高和氣密性好等技術(shù)特點(diǎn),器件衰減小,能量強(qiáng)度高,容易使用和維護(hù)。目前,公司依托于此封裝技術(shù)已經(jīng)開發(fā)了CMH3535/CMH6868等多系列UV LED產(chǎn)品及VCSEL產(chǎn)品,在客戶端具有較好的口碑和影響力。 

              CMH inorganic package technology is a novel package technology, which developed and patented by Guangzhou BYTECH Electronics CO., LTD. In brief, CMH inorganic package technology is to encapsulate the chip (UV LED/VCSEL…) in a cavity, which consists of inorganic material elements, such as ceramic, metal and hard glass, by a special welding technology. CMH inorganic package technology is originated in China, and it has the advantages of high reliability, high efficiency and good gas tightness. By now, based on CMH inorganic package technology, BYTECH already developed several series of UV LED products such as CMH3535/CMH6868, and got good reputation of customers.

              主要技術(shù)參數(shù):

              下圖
                 

              與國(guó)內(nèi)外同類產(chǎn)品或同類技術(shù)的比較情況:

              1、CMH全無機(jī)封裝技術(shù)100%采用無機(jī)材料進(jìn)行封裝,同行他家或多或少使用有機(jī)材料,避免了有機(jī)材料老化失效;

               CMH inorganic package technology 100% utilizes inorganic materials to avoid the aging failure of organic materials. In comparison, all of our competitors use organic materials, more or less. 

              2、相比同行產(chǎn)品,我公司的CMH全無機(jī)封裝的器件可加載1.1-1.5倍的電流;而且,使用和維護(hù)方便,能量高,衰減小,器件一致性好。 

              Compared with all of competitors, CMH inorganic products can load 1.1-1.5 times of current. 

              3、耐候性更好,可擦拭。 

              Better weatherability, and can use ethyl alcohol and non-dust cloth to clean the CMH inorganic products.

              經(jīng)濟(jì)評(píng)價(jià)分析:

              UVLED市場(chǎng)及應(yīng)用呈現(xiàn)快速發(fā)展的態(tài)勢(shì),國(guó)內(nèi)外也越來越多的企業(yè)搶進(jìn)這一細(xì)分領(lǐng)域。2015-2020年復(fù)合成長(zhǎng)率(CAGR)達(dá)34%,對(duì)2018年國(guó)內(nèi)市場(chǎng)調(diào)查,我司2018年銷售額占國(guó)內(nèi)比例高達(dá)10%。 The market and application of UVLED show a rapid development situation, and more and more companies at home and abroad are rushing into this subdivision. The compound growth rate(CAGR) reached 34 % in 2015-2020. In the 2018 survey of the domestic market, our sales in 2018 aced for as much as 10 % of domestic sales.

              技術(shù)及工藝創(chuàng)新要點(diǎn):

              1、CMH全無機(jī)封裝技術(shù)100%采用無機(jī)材料進(jìn)行封裝,避免了無機(jī)材料的老化失效; 

              CMH inorganic package technology 100% utilizes inorganic materials to avoid the aging failure of organic materials. 

              2、采用了特種焊接技術(shù)將芯片封裝于由無機(jī)材料組成的密閉腔體內(nèi),此種封裝技術(shù)可靠性高、效率高,適合產(chǎn)品量產(chǎn)。 

              Utilizes a special welding technology to encapsulate the chip in a cavity which consists of inorganic materials. This package technology has high reliability and efficiency, and is suitable for mass production.

              實(shí)際運(yùn)用案例和用戶評(píng)價(jià)意見:

              如下圖
                 

              獲獎(jiǎng)、專利情況:

              1、一種LED無機(jī)封裝用蓋板,趙延民,發(fā)明專利ZL201310715544.1; 

              A cover for inorganic LED package, Zhao Yanmin, invention patent NO. ZL201310715544.1; 

              2、一種LED用陶瓷基板,趙延民,發(fā)明專利ZL201310715532.9; 

              A ceramic substrate for LED, Zhao Yanmin, invention patent NO. ZL201310715532.9; 

              3、一種LED封裝方法,湯樂明,發(fā)明專利ZL201310220803.3; 

              A package method for LED,Tang Leming, invention patent NO. ZL201310220803.3; 

              4、一種LED及其封裝方法,趙延民,發(fā)明專利ZL201310220818.X; 

              A LED and its package method, Zhao Yanmin, invention patent NO. ZL201310220818.X.

              申報(bào)單位介紹:

              廣州市鴻利秉一光電科技有限公司是鴻利智匯集團(tuán)股份有限公司(股票代碼:SZ300219)下屬專業(yè)從事UV LED封裝及其應(yīng)用解決方案的子公司,是國(guó)家高新技術(shù)企業(yè),公司是國(guó)內(nèi)首家推出全無機(jī)氣密性封裝UV LED,依托CMH(陶瓷、金屬、玻璃)技術(shù)平臺(tái),致力于研發(fā)和生產(chǎn)高效、穩(wěn)定的UV LED封裝產(chǎn)品。公司處2013年12月成立至今,已經(jīng)申請(qǐng)專利13項(xiàng)發(fā)明專利,其中7項(xiàng)已授權(quán),目前產(chǎn)品在膠印、絲網(wǎng)印刷、柔性印刷、凹板印刷、噴繪、UV曝光、殺菌消毒、空氣凈化、3D打印等行業(yè)廣泛使用。

              Guangzhou Bytech Electronics Co.Ltd.is a subsidiary of Hongli Group whospecialize in UV LEDpakage and provide UV application solution.It is a national high-tech enterprise. Bytech is the first company in China to lunch full inorganic pakage UV LED which is based on CMH(Ceramic,Metal,hard glass)technology platfrom,and is committed to research and manufacture high quality and reliable UV LED.We has applied for 13 patents , inculding 7 authorized patents.At present,Our company UV LED product have been applied for flexible printing,offset printing screen printing,ink-jet printing,intaglio printing,UV exposure,air purification,sterilization,3D printing and other industries widely.

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